Call for Papers: IEEE MTT-S IMWS-5G 2018


Call for Papers

You are cordially invited to submit your latest research results to:

IEEE MTT-S International Microwave Workshop Series on 5G Hardware and System Technologies, August 30th-31st, 2018, Dublin, Ireland

Paper Submission Deadline April 16th, 2018. 

The next generation mobile network, the 5G, is expected to unlock many new services and provide a platform to enable growth in many industries. To bring 5G to reality, there are countless challenges lying ahead. Many of the most difficult scientific challenges are located at the “Physical Layer”, due to some fundamental limitations imposed by the nature of electromagnetic energy used. As a result, significant research is required to enable advanced microelectronic circuits and smart hardware implementation to achieve a working system. The IMWS-5G 2018 workshop provides a unique opportunity to bring together researchers and practitioners of different background to share the most recent advances in hardware and system technologies for 5G.


The IMWS-5G 2018 will be held at University College Dublin, Ireland. It will feature a two-day archival series of oral and poster presentations (in IEEE Xplore) with invited talks and tutorials. An industrial exhibit featuring a selection of state-of-the-art wireless and microwave products, measurement instruments and CAD software tools will also be held. The participation of young researchers and postgraduate students is strongly encouraged. Best Student Paper Awards will be made and a number of Young Researcher Travel Grants are available.

Technical contents include, but not limited to, the following areas:

  • 5G RF/millimeter-wave transceiver architectures
  • Highly integrated front-end modules and mixed-signal ICs
  • Large-scale phased-array, beamformers, MIMO antennas
  • High efficiency and broadband power amplifiers
  • Signal generation, modulation and frequency conversion circuits
  • Reconfigurable circuit elements, filters, multiplexers, etc
  • IoT sensors, RFID circuits/chips for 5G applications
  • RF/Microwave/mm-wave device, circuit and subsystem modelling
  • OTA measurement, MIMO system, device/circuit characterization
  • Energy harvesting, wireless power transfer circuits for 5G applications
  • Nonlinear circuit/system analysis and simulation tools
  • Digital calibration and linearization techniques and related algorithms

The IMWS-5G 2018 is sponsored by IEEE  Microwave Theory and Techniques Society (MTT-S), European Microwave Association (EUMA), IEEE 5G Initiative and local industry and funding agencies.

Important Dates
Paper Submission: April 16th, 2018
Decision Notification: June 30th, 2018
Final Paper Submission: July 20th, 2018
Conference Date:  August 30th-31st, 2018

Conference Chair/Co-Chairs

Anding Zhu, University College Dublin, Ireland

Tim Lee,  Boeing, USA

Tom Brazil, University College Dublin, Ireland


Technical Program Committee Chair/Co-Chair

Nuno Borges Carvalho, University of Aveiro, Portugal

Anding Zhu, University College Dublin, Ireland


Conference Treasurer/Secretary
Amy-Jo Peskens, University College Dublin, Ireland

General Enquiry